Increasing Solid Expandable Tubular Technology Reliability in a Myriad of Downhole Environments

Summary:

Since the spectacular arrival of solid expandable tubulars four years ago, customers have embraced this technology as a revolutionary well construction and production solution. Through innovative technical development and equipment reliability, solid expandable tubulars continue to grow in acceptance and use. Solid expandable tubulars have been used successfully to reach required total depth (TD) with adequate completion size, slim the well construction process, and overcome abnormal pressures encountered down hole while drilling. In addition, this technology has been used to rejuvenate wellbores for well deepening, casing reinforcement for stimulation, as a solution for corrosion problems, and to cover leaks and perforations. As a result, the overall cost of drilling and production operations has been reduced. This expansion process requires the successful integration of the following conditions and equipment: · casing capable of surviving in-situ reforming · friction reduction between the expansion cone and the casing · expandable flush joint connection · containment of hydraulic pressures during the entire expansion process · surviving expansion in downhole environment During the last four years, solid expandable tubulars have been installed in more than 113 wells. Reliability has improved from an average of 67% in 2000, to 83% in 2001, to over 95% in 2002. In the past, the reliability of solid expandable tubulars has been measured by a limited set of criteria for job success. The reliability definition should be expanded to include other perspectives of the total system. This paper will discuss actual downhole conditions, including well control, lost circulation, and high temperature/high mud weight, in which solid expandable tubulars were used as a successful solution. This paper will also discuss additional measurement perspectives with the goal of creating a 100% reliable technology.

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Overview
Document Type
Technical Paper
Date Published
Monday, April 28, 2003
Region
Latin America